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HBM Chips, a Fork in the Road

With the widespread adoption of AI servers, HBM (High Bandwidth Memory) has become a key player in the semiconductor industry. Industry insiders and outsiders are closely watching the evolut...

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2200°C, a new breakthrough in semiconductor single crystal growt...

Single crystals currently used in semiconductors, electronic devices, and optical equipment cannot withstand high temperatures. This is because the materials typically used to make them, such as iri...

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TSMC's 2nm leak: Inside story revealed

TSMC has entered a "one-man showdown" in advanced processes, with 2nm undergoing unprecedented investment and expansion. Etching is a critical equipment in the wafer fab's key processes. A unit ...

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Breakthrough in two key chip technologies

In 2024, imec introduced CMOS 2.0 as a new scaling paradigm to address the growing computing demands driven by diverse applications. In CMOS 2.0, systems-on-chip (SoCs) are divided into di...

Easelink Electronics - Electronic components Search

Breakthrough in two key chip technologies

In 2024, imec introduced CMOS 2.0 as a new scaling paradigm to address the growing computing demands driven by diverse applications. In CMOS 2.0, systems-on-chip (SoCs) are divided into di...

Easelink Electronics - Electronic components Search

The history of Russian lithography machines

The history of the US semiconductor industry has produced many legends, including Bell Labs, which invented the transistor; Gordon Moore, who pioneered Moore's Law; and Intel, which pioneere...

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It’s too early for robot chips to explode

There's been a lot of talk about physical AI, much of it very optimistic. Physical AI is happening, but progress is slower than many expected. It won't rival general artificial intelligence (G...

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CEO resigns, Magnachip plans to sell

The CEO of troubled South Korean power chipmaker Magnachip has resigned after a decade in the role, with the board deciding to sell the company and cut capital spending in half.

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TSMC withdraws from six-inch foundry

Market rumors recently surfaced that TSMC has verbally informed downstream customers that it will close its final 6-inch wafer fab in 2027, dedicating production lines to advanced packaging. TS...

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Micron announces the end of mobile NAND development

Given the continued weak financial performance of our mobile NAND products in the market and slower growth compared to other NAND opportunities, we will be halting future mobile NAND prod...

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Glass substrates, transformed overnight

In August 2024, a seemingly ordinary personnel change caused a stir in the semiconductor industry. Dr. Gang Duan, a longtime Intel chip packaging expert, quietly departed after 17 and a half yea...

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Gallium nitride is surpassing SiC

Two semiconductors—silicon carbide and gallium nitride—are locked in a (quite literally) fierce competition for circuits capable of operating at the highest temperatures. Silicon carbide chips onc...

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