New applications such as AI have erupted, making advanced packaging a hot topic again.

With the rapid development of emerging technologies such as artificial intelligence and big data, the performance of semiconductor chips has become higher and higher. Advanced packaging technology is the key link to improving chip performance. By stacking multiple chips or stacking together, advanced packaging technology can significantly improve computing performance, reduce power consumption, and meet increasingly increasingly increasing computing needs.

Earlier this month, the U.S. Department of Commerce announced that it would appropriation of up to 1.6 billion US dollars to develop new technologies (related reading) to develop computer chip packaging. FOPLP (fan-out panel packaging) technology, an important branch of advanced packaging technology, has frequently appeared in people's vision. FOPLP uses a large rectangular substrate to replace traditional circular silicon intermediary boards. The large encapsulation size can increase the area utilization and reduce the cost of the unit, and make up for the current COWOS advanced packaging capacity of insufficient production capacity.

In fact, a report was reported last month that people familiar with the matter said that TSMC's current rectangular substrate size is 510mm × 515mm, and the available area is more than three times that of the current 12 -inch circles. Although the study is in the early stage and "it may take a few years to be commercialized", it represents the major technological transformation of TSMC. Earlier, TSMC believed that the use of rectangular substrates was too challenging.

It is reported that TSMC developed FOWLP (fan -out wafer -grade packaging) technology named INFO in 2016, which is used for the A10 processor of the iPhone 7 series mobile phone. I hope to attract customers with lower production costs, but it has not been able to break through completely. Therefore, FOPLP is still staying in the terminal application, such as mature processes, such as power management IC and other products.

According to the analysis, the FOPLP developed by TSMC can be considered as a rectangular Info, and it has the advantages of low -unit costs and large -scale packaging. It can further integrate other technologies on TSMC's 3D Fabric platform to develop advanced packaging 2.5D/3D and other advanced packaging. Essence It can also be considered a rectangular Cowos. At present, the product is locked in the AI GPU field and the customer is Nvidia. If progress is smooth, it may be unveiled from 2026 to 2027.