TSMC, the leading foundry company, announced today that its consolidated revenue for September 2024 was approximately NT$251.873 billion, an increase of 0.4% from the previous month and 39.6% from the same period last year. Its September revenue jumped to the second highest in history. The cumulative revenue from January to September 2024 was approximately NT$225.847 billion, an increase of 31.9% from the same period last year.

Source: The content comes from Semiconductor Core News

TSMC's highest monthly revenue in history was NT$256.953 billion in July this year, the second highest was NT$250.866 billion in August, and October 2023 (NT$243.203 billion) was the third highest in history. The September revenue announced today was NT$251.873 billion, which squeezed out August's revenue and jumped to the second highest in history.The revenue of July and August added up to NT$507.819 billion, and the September revenue only needed to exceed NT$220.2 billion to meet the target; if the September revenue exceeded NT$246.181 billion, it would be able to leap the high mark. Now September's revenue has not only leapt the high mark, but also jumped to the second highest in history.TSMC's third-quarter revenue reached NT$759.692 billion, an annual increase of 38.95% compared to last year's Q3 revenue of NT$546.73 billion. Compared with this year's second-quarter revenue of NT$673.51 billion, it increased by 12.79% quarter-on-quarter. Q3 revenue increased both monthly and quarterly. TSMC previously estimated at its earnings conference that its third-quarter revenue would be between $22.4 billion and $23.2 billion. This estimate was based on an exchange rate assumption of 1 USD to 32.5 NT dollars, which translates to approximately NT$728 billion to NT$754 billion, a quarterly increase of 7.6% to 11%. Management also estimated that Q3 gross margin would be between 53.5% and 55.5% (median value 54.5%).

01 AMD becomes TSMC's second largest customer in the United States

While TSMC is making great strides, is AMD also expected to become TSMC's second largest customer?Meanwhile. AMD will reportedly produce its high-performance computing chips at TSMC's Fab 21 in Phoenix, Arizona.Following Apple, independent journalist Tim Culpan reported that AMD and TSMC had confirmed the agreement on October 7, although the chipmaker declined to comment on the deal.TSMC is building three fabs in Phoenix, Arizona, two of which will produce 4nm and 3nm semiconductors, and the third will produce 2nm chips. Apple's A16 Bionic chip has begun production at Fab 21, using TSMC's N4P process, an extension of the company's 5nm process series, but with an 11% performance improvement and 22% energy efficiency improvement compared to N5.While no further information about the chips AMD plans to produce has been disclosed, Fab 21 is only capable of producing N4 and N5 technologies. Earlier this week, TSMC signed a memorandum of understanding with Amkor Technology, a US semiconductor product packaging and test services company, according to which Amkor will provide turnkey advanced packaging and testing services to TSMC at its outsourced semiconductor assembly and test (OSAT) facility in Peoria, Arizona. Both TSMC and Amkor received funding from the US government under the Chips and Science Act to support the construction of their factories in Arizona. Kalpan also revealed that TSMC is in talks with multiple customers about tapeouts in Arizona next year, and another chip design company may also be confirmed as its customer in the near future.

02 TSMC packaging, heading to the United States

Taiwan Semiconductor Manufacturing Company (TSMC) has signed an advanced semiconductor packaging and test agreement with Arizona-based Amkor Technology, which has been providing semiconductor packaging and test services to the Taiwanese company for many years.Under the agreement, the turnkey packaging and test services that Amkor Technology plans to provide at its Peoria, Arizona facility will support TSMC's customers, especially those using its advanced wafer manufacturing facilities in Phoenix. "The close collaboration and proximity of TSMC's front-end factories and Amkor's back-end factories will accelerate overall product cycles," Amkor said in a press release. The release also explained that the two companies will jointly define specific packaging technologies used to support "common customer needs," such as TSMC's Integrated Fan-Out (InFO) and Chip-on-wafer-on-substrate (CoWoS). "Our customers are increasingly relying on advanced packaging technologies to enable breakthroughs in advanced mobile applications, artificial intelligence, and high-performance computing, and TSMC is pleased to work side-by-side with a trusted, long-term strategic partner like Amkor to support them with a more diverse manufacturing footprint,” said Dr. Kevin Chang, TSMC’s senior vice president of business development and global sales and deputy co-chief operating officer. What was not mentioned in the press release, but has been reported elsewhere, is that the partnership will bring more U.S.-based chips to Apple hardware.In November 2023, Amkor announced plans to invest approximately $2 billion in its first domestic outsourced semiconductor assembly and test (OSAT) facility in Peoria, and this summer the company signed a non-binding preliminary memorandum of terms with the U.S. Department of Commerce to receive up to $400 million in proposed direct funding and up to $200 million in proposed loan funding as part of the Chips and Information Processing Act. "Amkor's Arizona facility will enable us to support the growing semiconductor manufacturing industry while creating 2,000 good jobs, and we look forward to providing our customers with domestic advanced packaging and test capabilities. Advanced packaging is an important component of semiconductor innovation and manufacturing, and we appreciate our partners at the Department of Commerce recognizing the importance of this area and working to support our industry," said Giel Rutten, Amkor president and CEO, at the time.