Source: Content compiled from idtechex

In the rapidly evolving semiconductor space, chiplet technology is emerging as a disruptive approach that addresses many of the challenges facing traditional monolithic system-on-chip (SoC) designs. As Moore's Law slows, the semiconductor industry is seeking innovative solutions to increase performance and functionality beyond just increasing transistor density. Chiplets offer a promising path forward, providing flexibility, modularity, customizability, efficiency, and cost-effectiveness in chip design and manufacturing. Companies such as AMD and Intel have been at the forefront of this technology, with products such as AMD's EPYC processors and Intel's Ponte Vecchio data center GPUs demonstrating the potential of chiplets to increase core counts and integrate a variety of functions.

Chipsets are discrete, modular semiconductor components that are individually designed and manufactured before being integrated into a larger system. This approach is similar to an SoC on a module, where each chipset is designed to work in conjunction with the others, and therefore needs to be co-optimized in design. The modularity of chipsets aligns with key semiconductor trends such as IP siliconization, integrated heterogeneity, and I/O incrementalization. Chipsets are also associated with heterogeneous integration and advanced packaging.

Why Chiplet is becoming more and more popular

The slowdown of Moore's Law has made it increasingly difficult to add more transistors within a limited area. Instead, the focus has shifted to increasing functional density - where chip design excels. At the same time, development efforts are increasingly focused on system-level integration, rather than just wafer fabrication.

Chiplet technology was adopted because it is able to address several key limitations inherent to traditional monolithic chip design. One advantage is its ability to overcome limitations such as reticle size and memory walls, which have traditionally hampered the performance and scalability of semiconductor devices. By modularizing chip functionality into discrete chiplets, manufacturers can more effectively optimize the use of semiconductor materials and processing nodes. In addition, chiplets can better utilize wafer corner space and reduce chip defect rates, which are often underutilized in traditional chip designs, especially in large SoCs that require more and more functionality. Discrete components can be tested and verified individually before integration. As a result, manufacturing yields are improved, resulting in higher output quality and lower unit costs. In addition, chiplets facilitate a more flexible design process, integrating a variety of functions tailored to specific applications without the need for a completely new chip design. This flexibility not only reduces development time and costs, but also allows for rapid adaptation to changing technology needs.

The properties of chiplets enable manufacturers to source different components from multiple suppliers in different regions. This diversification reduces dependence on any single supplier or geographic region, thereby enhancing supply chain resiliency. In the context of geopolitical tensions and trade restrictions, chiplet technology provides a strategic advantage by reducing the risks associated with supply disruptions. By adopting a chiplet design, companies can more effectively address these restrictions and ensure a steady supply of critical components without over-dependence on regions subject to political instability or trade sanctions.

Collectively, these factors make chiplet technology an attractive option for manufacturers seeking to improve performance while maintaining economic efficiency.

The global core pellets market is experiencing significant growth. This market is expected to reach $411 billion by 2035, driven by high-performance computing needs in industries such as data centers and artificial intelligence. The modular nature of core particles allows rapid innovation and customization to meet specific market needs while reducing development time and costs.

While core particles offer numerous advantages, they also present new challenges. The integration of multiple die requires advanced interconnect technologies and standards to ensure seamless communication between components. Thermal management is another critical area, as increased functional density can lead to overheating if not managed properly. These challenges present opportunities for various players in the supply chain. For example, different areas of the package in a die design require different types of underfill materials to meet specific needs, such as protecting the chip itself, providing mechanical support and thermal stability, and protecting the delicate wires and solder balls connecting the die to prevent breakage. Problems such as layering or separation. This creates a need for innovative materials that improve reliability and performance.

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