Home Product RF and Wireless RFI and EMI - Contacts, Fingerstock and Gaskets 67SLG050050030PI00
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67SLG050050030PI00

  • Manufacturer

    Laird - EMI
  • Manufacturer Product Number

    67SLG050050030PI00

  • Description

    RFI FILM OVER FOAM PU SOLDER

  • Datasheet

    Easelink Electronics - Electronic components SearchDatasheet

In Stock    3,793

Quantity

Easelink Electronics - Electronic components Search

Product Attributes

TYPEDESCRIPTION
CategoryRFI and EMI - Contacts, Fingerstock and Gaskets
MfrLaird Technologies EMI
SeriesSMD Grounding Metallized
PackageTape & Reel (TR)-->Cut Tape (CT)
Part StatusActive
TypeFilm Over Foam
Operating Temperature-40°C ~ 70°C
ShapeRectangle
Width0.197" (5.00mm)
Length0.118" (3.00mm)
Height0.197" (5.00mm)
MaterialPolyurethane Foam, Tin-Copper Polyester (SN/CU)
Plating-
Plating - Thickness-
Attachment MethodSolder
Shelf Life Start-
Shelf Life-
Storage/Refrigeration Temperature-

Environmental & Export Classifications

ATTRIBUTEDESCRIPTION
RoHS StatusRoHS Compliant
Moisture Sensitivity Level (MSL)Not Applicable
REACH Status-
ECCNEAR99
HTSUS8536.90.4000

Additional Resources

ATTRIBUTEDESCRIPTION
Other Names903-1590-2-->903-1590-6-->903-1590-1
Standard Package1,500

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