Home Product RF and Wireless RFI and EMI - Contacts, Fingerstock and Gaskets 67SLG050050030PI00
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67SLG050050030PI00

  • Manufacturer

    Laird - EMI
  • Manufacturer Product Number

    67SLG050050030PI00

  • Description

    RFI FILM OVER FOAM PU SOLDER

  • Datasheet

    Easelink Electronics - Electronic components SearchDatasheet

In Stock    4,615

Quantity

Easelink Electronics - Electronic components Search

Product Attributes

TYPE DESCRIPTION
Category RFI and EMI - Contacts, Fingerstock and Gaskets
Mfr Laird Technologies EMI
Series SMD Grounding Metallized
Package Tape & Reel (TR)-->Cut Tape (CT)
Part Status Active
Type Film Over Foam
Operating Temperature -40°C ~ 70°C
Shape Rectangle
Width 0.197" (5.00mm)
Length 0.118" (3.00mm)
Height 0.197" (5.00mm)
Material Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Plating -
Plating - Thickness -
Attachment Method Solder
Shelf Life Start -
Shelf Life -
Storage/Refrigeration Temperature -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status -
ECCN EAR99
HTSUS 8536.90.4000

Additional Resources

ATTRIBUTE DESCRIPTION
Other Names 903-1590-2-->903-1590-6-->903-1590-1
Standard Package 1,500

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