Source: Content compiled from electropages
Diamond power semiconductors are poised to transform industries from electric vehicles to power stations with their superior performance. Japan's major advances in diamond semiconductor technology have paved the way for its commercialization, with the potential to one day enable these semiconductors to produce 50,000 times more power than silicon devices.
Companies such as Orbray and Power Diamond Systems have made significant progress in mass-producing diamond wafers and components as Japan leads R&D efforts in the field. As the potential commercialization of diamond semiconductors gets closer, the industry is poised for significant growth and innovation.
A. Diamond semiconductors can handle up to 50,000 times more electrical energy than traditional silicon devices, making them ideal for high-demand applications such as electric vehicles and aerospace.
B. Japan is a leader in diamond semiconductor research, with companies such as Orbray and Power Diamond Systems committed to achieving scalable production to meet future commercial needs.
C.University and industry collaborations, including with Saga University and the Japan Aerospace Exploration Agency, are driving diamond technology toward space applications, enhancing its durability and signal integrity in harsh environments.
D. As diamond technology matures, its adoption will lead to more sustainable and efficient electronic devices, in line with the global trend towards eco-efficient technologies and renewable energy solutions.
How will the widespread use of diamond semiconductors affect the efficiency and performance of electric vehicles and power stations, what challenges need to be overcome for the successful commercialization of diamond semiconductors, and how will the emergence of Japanese diamond semiconductors affect global semiconductor market dynamics?
The dawn of the electrification of modern society has created an urgent need for high-power electronic devices that can efficiently and sustainably handle larger loads. As our dependence on technology continues to grow, so does the need for materials that support the next generation of power electronics.
Conventional silicon, while widely used, is increasingly reaching its efficiency limits, especially under conditions of high temperature and pressure. As a result, attention has turned to materials such as silicon carbide (SiC) and gallium nitride (GaN), which have demonstrated superior performance in these areas. However, the exploration does not stop there; diamond, long admired for its aesthetic qualities, is now being investigated for its potential as a new type of power semiconductor.
Diamond is a crystalline form of carbon and is known not only for its hardness and brightness, but also for its excellent electrical and thermal properties. These properties make it an attractive candidate for power electronics.
For example, diamond's high thermal conductivity allows it to efficiently dissipate heat, a key factor in electronic devices, as overheating can cause device failure. Diamond's wide bandgap also means that diamond-based devices can operate at higher voltages and temperatures than those made from silicon.
Despite these promising properties, there are still many major challenges to be solved before diamond can be widely used in the semiconductor field. One of the main obstacles is its hardness.
While the hardness of diamond is an ideal property for cutting and wearing materials, it presents unique challenges to semiconductor manufacturing. The difficulty in cutting and shaping diamonds makes manufacturing diamond-based devices not only technically challenging but also costly.
In addition, the applicability of diamond in long-term device applications is constrained by its tendency to degrade over time. The stability of diamond under long-term operating conditions remains a research topic. This degradation affects the performance and life of diamond-based electronic devices, which may limit their practical applications.
Another major challenge is that diamond technology in the field of power semiconductors is relatively new. Unlike silicon, which has been at the core of semiconductor technology for decades, diamond has not benefited from a mature technology ecosystem.
Due to the new properties of diamond in semiconductors, researchers and engineers are starting from scratch in many ways. This immaturity means that there is still a lot of basic work to be done, from developing reliable manufacturing processes to understanding the long-term behavior of diamond under various operating pressures.
Finally, the complex crystal structure of diamond makes its operation in the production process complicated. Manufacturing high-quality diamond semiconductors requires precise control of material properties at the microscopic level, a task involving complex technology and a large amount of capital investment. Therefore, the cost of producing diamond devices remains the main obstacle to their widespread application in the semiconductor industry.
Japan has made a remarkable leap forward in semiconductor technology, with the potential for major advances in diamond semiconductors that could see practical applications between 2025 and 2030. These developments are particularly noteworthy because diamond semiconductors are known for their exceptional performance and ability to handle extreme conditions, which could transform a variety of high-demand electronics industries.
Diamond semiconductors are characterized by their ability to operate at extremely high voltages and withstand temperatures that silicon can't match. Their use in energy-intensive applications such as electric vehicles and aerospace could mark a radical shift, reducing heat losses and extending device life. Japan's advances, especially those coming from university-led R&D, show that the country is focused on gaining a leading position in a highly competitive field, where materials such as silicon and gallium nitride currently dominate.
Saga University has been at the forefront of this innovation, developing the world's first power device made of diamond semiconductors in 2023. This breakthrough was achieved in collaboration with the Japan Aerospace Exploration Agency (JAXA) and focused on high-frequency components for space communications. The impact of this technology is not limited to terrestrial applications, but may also improve the reliability and performance of space exploration equipment.
The emphasis on high-frequency components for space applications demonstrates the potential of diamond to improve signal integrity in extreme environments. JAXA's collaboration with Saga University on these projects highlights the appeal of diamond semiconductors not only for their durability, but also for their ability to enable more efficient power management for satellite and spacecraft systems, a key factor in space exploration missions where reliability is critical.
In addition, Tokyo-based Orbray has developed mass production technology for 2-inch diamond wafers and is moving toward the goal of achieving 4-inch substrates. This scale-up is critical to meeting the commercial needs of the electronics industry. Orbray's collaboration with Anglo American and its partnership with Mirai Technologies, which is backed by giants such as Toyota and Denso, highlights the industry's commitment to integrating diamond semiconductors into mainstream applications, including in-vehicle power devices expected in the 2030s.
As Orbray expands its production capacity, the industry is closely watching whether diamond wafers can surpass silicon and even silicon carbide substrates in high-power devices. Once 4-inch diamond substrates are commercialized, a key bottleneck in production will be solved, bringing the feasibility of widespread industrial applications one step closer and enabling Japan's semiconductor industry to set new standards worldwide.
The expansion does not stop there. Orbray plans to build a new plant in Akita Prefecture to increase production capacity and plans an initial public offering in 2029. Meanwhile, startups such as Power Diamond Systems and Ookuma Diamond Device are strengthening the technology's applications in power efficiency and environmental cleanliness, respectively. Power Diamond Systems, a spin-off company of Waseda University, is enhancing the current-carrying capacity of these devices, while Ookuma Diamond Device is focused on deploying them at the Fukushima Daiichi Nuclear Power Plant for nuclear waste removal, demonstrating the material's resistance to high radiation.
This toughness is not only critical for applications with high radiation levels, but also enhances diamond's suitability for use in high-pressure environments such as nuclear power facilities. By applying these devices to nuclear waste removal, companies such as Ookuma Diamond Device are demonstrating how diamond semiconductors can bring about changes in the energy and environmental fields, providing a lasting alternative to traditional materials.
This booming industry not only highlights the technological strength and innovative spirit of Japanese R&D, but also highlights a major shift in materials science, namely that diamond semiconductors may become the cornerstone of future electronic and power devices. As these technologies mature, they are likely to be widely adopted in various fields from electric vehicles to aerospace, which may set a new standard for the industry, promising to make these devices not only more robust than silicon-based devices, but also more efficient.
Incorporating diamond semiconductors into energy-intensive technologies can reduce overall power consumption while improving reliability, a combination that meets the growing demand for sustainability. As industries continue to prioritize eco-efficient technologies, the shift to diamond-based solutions could further incentivize a shift to renewable energy, given diamond's superior thermal management and power capabilities.
Japan's leadership in diamond semiconductor innovation highlights the global race to develop advanced materials to push the boundaries of electronic design. Diamond technology has the potential to simultaneously meet regulatory and environmental standards, consistent with a sustainable future, making Japan's R&D efforts stand out in the international semiconductor field.
The advent of diamond semiconductor technology does not signal the obsolescence of GaN or SiC, but rather marks the diversification of the materials available to engineers. Each material has unique properties that make it possible to design more complex and personalized electronic systems. As engineers and scientists, our task is not to find one “best” semiconductor material, but to understand and exploit the unique strengths of each material and to work in harmony with the others.
As diamond semiconductor technology becomes commercialized, it will indeed open up new avenues for innovation. Engineers will face new challenges and opportunities to push the boundaries of what is possible in electronic design. Exploring the potential of diamond in electronics involves not only adopting new materials, but also rethinking the way we solve engineering problems and design systems.
While excitement about diamond semiconductors is understandable, it is critical to maintain a balanced perspective. The future of semiconductor technology will likely be characterized by a mix of materials, each selected for its ability to meet specific technology requirements in a cost-effective manner. The interplay between diamond, GaN, and SiC semiconductors will shape the next generation of electronic devices, driving innovation while addressing the realities of cost and application-specific needs. This nuanced approach will ensure the sustainability of semiconductor technology to meet the ever-expanding range of applications in the modern world.
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