SK Hynix announced on the 19th that it will become the first memory company to mass-produce the fifth-generation high-bandwidth memory (HBM) HBM3E. It will begin supplying products to NVIDIA at the end of this month.

"Following HBM3, we will be the first to offer HBM3E to customers, which achieves the highest performance of existing DRAM," SK hynix said, adding, "We will continue to maintain our competitive advantage in the artificial intelligence (AI) memory market successfully. Mass production of HBM3E".

SK Hynix explains that its HBM3E offers optimal performance in all areas required for AI memory, including speed and heat control. The product can process up to 1.18 terabytes of data per second, equivalent to more than 230 FHD (Full High Definition) movies (5 GB) in one second.

SK Hynix said that it has applied the Advanced MR-MUF process to the new product to control heat generation, and the heat dissipation performance is 10% higher than the previous generation.

MR-MUF is a process that stacks semiconductor chips and then injects and hardens a liquid protective material into the spaces to protect the circuits between the chips. The process is believed to be more efficient and effective at dissipating heat than the method of laying down thin-film-type materials each time the chips are stacked.

Analysts said SK Hynix's HBM production capacity is fully booked through 2024 as explosive demand for artificial intelligence chipsets drives demand for high-end memory chips used in them.

SK hynix Vice President Ryu Seong-soo (in charge of HBM business) said, "With the world's first mass production of HBM3E, we have strengthened our product lineup leading the AI memory industry," adding, "Building on the successful HBM business, we have With the accumulated experience, we have strengthened customer relationships and created "total solutions". "We will strengthen our position as an artificial intelligence memory provider."

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