Home News X-FAB leads the European capital alliance

X-FAB leads the European capital alliance

2023-05-09

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X-FAB leads the European capital alliance to help the industrialization of the European silicon photonics value chain


X-FAB Silicon Foundries ("X-FAB"), recognized globally as a premier analog/mixed-signal foundry, today announced that it is launching the photonixFAB project --- a project designed to provide SMEs and large entities in the field of optoelectronics. Innovative empowerment enables it to easily obtain low-loss silicon nitride (SiN) and silicon-on-insulator (SOI) optoelectronic platforms with heterogeneous integration capabilities of indium phosphide (InP) and lithium niobate (LNO). In doing so, X-FAB Silicon Foundries (“X-FAB”), a leader in the analog/mixed-signal foundry space, is leading a strategic initiative to drive greater autonomy for the European semiconductor and optoelectronics industries, Thereby strengthening the continent's manufacturing capabilities in key emerging sectors.

The photonixFAB alliance is mainly composed of listed companies, private companies and respected research institutions --- they all focus on the development and manufacture of next-generation silicon optoelectronic products. These high-profile partners include LIGENTEC, SMART Photonics, PHIX Photonics Assembly and Luceda Photonics in technology and manufacturing services; Nokia, NVIDIA, Aryballe, Brolis Sensor Technology and PhotonFirst in application development; and cutting-edge research organizations CEA-Leti and imec.

Its goal is to build the value chain of European optoelectronic devices and create initial industrial manufacturing capabilities, thereby opening up a scalable mass production path for innovative product developers.


photonixFAB will cover a comprehensive set of photonics foundry and assembly capabilities, including:

Provides industrial-scale silicon photonics manufacturing services for low-loss SiN and SOI-based PICs to lower barriers to entry and enable fast turnaround; 

On the PIC platform based on SiN and SOI, realize the micro-transfer printing technology of heterogeneous integration of active and passive components based on InP, LNOI and germanium;

Develop scalable packaging and testing solutions for the development of (heterogeneous) PIC platforms;

Provide design automation functions based on process design kits for optoelectronic platforms.

As part of the project, six demonstration schemes are currently being built to validate the implemented optoelectronics value chain, including data communication and optical switches, coherent optical transceivers, infrared spectrometers for sensing, Applications such as digital olfactory sensors and health monitoring demonstrators.


In addition, thanks to the manufacturing capabilities of the photonixFAB project, a large number of potential opportunities for cutting-edge optoelectronic devices will be discovered, including data communication, telecommunications, biomedical sensors/detectors, quantum computing and automotive LiDAR.

"We see great potential, and traditional semiconductor suppliers, OEMs, and start-up companies are exploring applications that support optoelectronics technology." X-FAB CEO Rudi De Winter said, "Therefore, it is now time for companies to focus on Europe The timing is right for the Center to jointly build a silicon photonics ecosystem that will help drive the continent's competitive strength in this exciting new market."

The project is supported by the Critical Digital Technologies Joint Task Force (KDT JU), with funding from the EU and national governments. Combined with direct contributions from each of the Union members, this funding totals €47.6 million. The main work of this 3.5-year project will be carried out at X-FAB's foundry in Corbeil-Essonnes, France, and other activities will also be carried out at various partner factories in Europe.


About X-FAB:

X-FAB is a leading analog/mixed-signal and MEMS foundry group producing silicon wafers for automotive, industrial, consumer, medical and other applications. X-FAB uses modular CMOS and SOI processes ranging in size from 1.0μm to 130nm, and its characteristic SiC and MEMS long-life processes to create the highest quality standards, excellent manufacturing processes and innovative products for global customers. solution. X-FAB's analog-digital integrated circuits (mixed-signal ICs), sensor MEMS are produced at six production sites in Germany, France, Malaysia and the United States, and have approximately 4,000 employees worldwide. www.xfab.com

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